| PART |
Description |
Maker |
| JE93I9HTR5 JE9 JE9112HR1 JE9112HR2 JE9112HR3 JE911 |
Digital Media System-on-Chip (DMSoC) 338-NFBGA 大功率磁保持继电
2.0mV Quad Ultra Micropower Rail-to-Rail CMOS Operational Amplifier, 24L SOIC 大功率磁保持继电
HIGH POWER LATCHING RELAY 大功率磁保持继电
Energy Harvesting Module w/ connector, 1.8V to 3.6V, 4.6mJ, 68msec@25mA
Energy Harvesting Module w/ connector, 3.1V to 5.2V, 55mJ, 88msec@150mA
Energy Harvesting Module w/ connector, 3.1V to 5.2V, 8.3mJ, 80msec@25mA
Energy Harvesting Module w/ connector, 1.8V to 3.6V, 30mJ, 75msec@150mA
SOIC socket added to Adapter Module
|
Hongfa Relay
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Xiamen Hongfa Electroacoustic Co., Ltd.
厦门宏发电声股份有限公司
HONGFA[Hongfa Technology]
|
| 74488540070 |
WE-EHPI Energy Harvesting Coupled Inductor
|
Wurth Elektronik GmbH & Co. KG, Germany.
|
| LTC3331-15 |
Nanopower Buck-Boost DC/DC with Energy Harvesting Battery Charger
|
Linear Technology
|
| MAX17710GB MAX17710GBT MAX1771013 MAX17710GT MAX17 |
Energy-Harvesting Charger and Protector
Energy-Harvesting Charger and Protector
|
Maxim Integrated Products
Maxim Integrated Produc...
|
| M24LR64E-R |
64-Kbit EEPROM with password protection, dual interface & energy harvesting: 400 kHz I2C bus & ISO 15693 RF protocol at 13.56 MHz
|
STMicroelectronics
|
| MCP1810 |
Energy Harvesting
|
Microchip Technology
|
| AS8218 AS8228 |
Highly Integrated Single Phase 2-Current Energy Metering Integrated Circuits with Microcontroller, RTC, Programmable Multi-Purpose I/Os and LCD Driver
|
AMSCO[austriamicrosystems AG]
|
| MAX1112-MAX1113 MAX1113EEET MAX1113CEET MAX1112EAP |
5V, Low-Power, Multi-Channel, Serial 8-Bit ADCs 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO20
5V, Low-Power, Multi-Channel, Serial 8-Bit ADCs 5V，低功耗，多通道，串位ADC
5V / Low-Power / Multi-Channel / Serial 8-Bit ADCs
|
Maxim Integrated Products, Inc.
|
| AD6640 AD6640STPCB AD6640ASTZ |
AD6640/AD6620 Multi-Channel, Multi-Mode Receiver Chipset
12-Bit, 65 MSPS IF Sampling A/D Converter
|
Analog Devices
|
| CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K
IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ
IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52
8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20
IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
|
